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进口德律TRI TR7700Q 3D在线高速高精度自动光学检测机 (AOI)
型号: TR7700Q
净重: 650KG
保修期: 12个月
品牌: TRI
机器尺寸: 1000*1400*1650
Cylce Time: 21cm²/sec -4Mpix
PCB尺寸: 510mm*460mm
功率: 3KW
电压: 220V
产品详情

INTRODUCTION




SPI-1.jpg德律 TRI TR7700Q 3D AOI 拥有数位四向条纹光投影技术,结合最新颖的2D+3D 检测技术,为组装电路板检测领域掀起全新革命。全方位3D数位条纹光技术涵盖检测范围广阔,拥有极佳的精准性呈现极小共面缺陷及焊点问题。

TRI的3D锡点及爬锡检测符合IPC标准,确保爬锡的品质。藉由检查爬锡高度及体积,

TR7700Q 3D AOI可检测出少锡、缺锡、空焊等不良现象。








  • 超高精准度 2D+3D AOI 走停式取像

  • 爬锡高度及体积检测功能

  • 清晰且可靠的3D四光源数位条纹光

  • 可变频3D检测范围高度高达 30 mm

  • 免空压智能化自动运输送带系统(IACS)



产品规格介绍




Optical System


Imaging Method

Stop-and-Go Imaging

Top Camera

4 Mpix or 12 Mpix (factory setting)

Angle Camera

N/A

Imaging Resolution

5.5 μm, 10 μm, 15 μm (factory setting)

Lighting

Multi-phase True Color LED

3D Technology

Quad Digital Fringe Projectors

Max. 3D Range

4 Mpix@ 15 μm: 0-30 mm*

12 Mpix@ 5.5 μm: 0-4 mm

12 Mpix@ 10 μm: 0-30 mm*


*Need GPU card upgrade



Inspection Performance


Imaging Speed

4 Mpix@ 15 μm: 21 cm²/sec

12 Mpix@ 10 μm: 14.5 cm²/sec

12 Mpix@ 10 μm: 23 cm²/sec with optional CoaXPress


Note: Depending on component distribution




Motion Table & Control

X-Axis Control

Ballscrew + AC-servo controller

Y-Axis Control

Ballscrew + AC-servo controller

Z-Axis Control

Ballscrew + AC-servo controller

X-Y Axis Resolution

1 μm with linear encoder


Board Handling

Max PCB Size

TR7700QI @ 5.5 μm: 330 x 330 mm*

TR7700QI @ 10 μm, 15 μm: 510 x 460 mm

TR7700QI DL @ 10 μm, 15 μm: 510 x 310 mm x 2 lanes, 510 x 590 mm x 1 lane


*Depending on component distribution, the vailable PCB size could be different

PCB Thickness

0.6-5 mm

Max PCB Weight

3 kg

Top Clearance

5.5 μm: 25 mm

10 μm: 50 mm

15 μm: 40 mm

Bottom Clearance

40 mm [100 mm optional]

Edge Clearance

3 mm [5 mm optional]

Conveyor

Inline

Height: 880 – 920 mm


* SMEMA Compatible



Inspection Functions


Component

Missing

Tombstoning

Billboarding

Polarity

Rotation

Shift

Wrong Marking (OCV)

Defective

Upside Down

Extra Component

Foreign Material

Lifted Component

Solder

Solder Fillet Height

Solder Volume %

Excess Solder

Insufficient Solder

Bridging

Through-hole Pins

Lifted Lead

Golden Finger

Scratch/Contamination




Dimensions

WxDxH

TR7700Q: 1000 x 1400 x 1650 mm

TR7700Q DL: 1000 x 15000 x 1650 mm


Note: not including signal tower, signal tower height 520 mm

Weight

TR7700Q: 650 kg

TR7700Q DL: 685 kg








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